Process image according to mat characteristic

ABSTRACT

Examples disclosed herein relate to a mat characteristic to process images. Examples include to acquire an image of a mat from a camera in a computing device; to process the image according to the mat characteristic in the computing device; and to display the processed image.

PRIORITY INFORMATION

This application is a continuation of U.S. National Stage applicationSer. No. 15/500,828 filed on Jan. 31, 2017, which claims priority toApplication No. PCT/US2014/049285 filed on Jul. 31, 2014, the contentsof which are incorporated herein by reference in its entirety.

BACKGROUND

Various distortions may appear in images captured by a camera. Methodsof altering an image to reduce these distortions and adjust other imageproperties have been developed for physical camera images. Methods ofadjusting image properties in a digitally captured image have beendeveloped. In some examples, a user may alter the captured image whilethe image is displayed to preview the impact of the adjustment. In otherexamples, an image may be processed to adjust image properties before itis displayed.

BRIEF DESCRIPTION OF THE DRAWINGS

The following detailed description references the drawings, wherein:

FIG. 1 is a schematic perspective view of an example of a computersystem in accordance with the principles disclosed herein;

FIG. 2 is another schematic perspective view of the computer system ofFIG. 1 in accordance with the principles disclosed herein;

FIG. 3 is a schematic side view of the computer system of FIG. 1 inaccordance with the principles disclosed herein;

FIG. 4 is a schematic front view of the computer system of FIG. 1 inaccordance with the principles disclosed herein;

FIG. 5 is a schematic side view of the computer system of FIG. 1 duringoperation in accordance with the principles disclosed herein;

FIG. 6 is a schematic front view of the system of FIG. 1 duringoperation in accordance with the principles disclosed herein;

FIG. 7 is a black box circuit diagram of the computer system of FIG. 1in accordance with the principles disclosed herein;

FIG. 8 is a schematic perspective view of a mat of FIG. 1 in accordancewith the principles disclosed herein;

FIG. 9 is a block diagram of an example computing device to process animage captured in the system of FIG. 1 in accordance with the principlesdisclosed herein; and

FIG. 10 is a flowchart of an example method for image processing.

DETAILED DESCRIPTION

Certain terms are used throughout the following description and claimsto refer to particular system components. As one skilled in the art willappreciate, computer companies may refer to a component by differentnames. This document does not intend to distinguish between componentsthat differ in name but not function. In the following discussion and inthe claims, the terms “including” and “comprising” are used in anopen-ended fashion, and thus should be interpreted to mean “including,but not limited to . . . .” Also, the term “couple” or “couples” isintended to mean either an indirect or direct connection. Thus, if afirst device couples to a second device, that connection may be througha direct electrical or mechanical connection, through an indirectelectrical or mechanical connection via other devices and connections,through an optical electrical connection, or through a wirelesselectrical connection. As used herein the term “approximately” meansplus or minus 10%. As used herein, “image processing,” “to process” animage, or “processing” an image refers to any device, system, or methodto adjust features or properties of a captured image. In addition, asused herein, the phrase “user input device” refers to any suitabledevice for providing an input, by a user, into an electrical system suchas, for example, a mouse, keyboard, a hand (or any finger thereof), astylus, a pointing device, etc.

Images captured by a camera may be processed to more accurately reflectthe captured scene. In some examples, the brightness and contrast of acaptured image may be adjusted to more accurately capture real worldconditions. In other examples, a user may seek to alter brightness andcontrast of an image for artistic effect. In digital camera systems, thecamera may automatically adjust certain features of an image or providestandard adjustment options to a user. However, these adjustments maynot correct all distortions in the captured image.

To address these issues, in the examples described herein, a computingsystem may adjust captured images from a fixed camera according to acharacteristic of a computing system component in the field of view ofthe camera. In some example, the computing device may process thecaptured image according to a mat characteristic of a mat in the fieldof view of a camera. For example, the computing device may adjust colorbalance of the captured image according to a known color and reflectanceof the mat. In an example, various sensors in the computing system mayprovide additional information about environmental factors that may beused for image processing. In an example, the mat may be atouch-sensitive mat to detect the location of an object on the mat andthe computing device may adjust image illumination according to theknown location of the object and an ambient light sensor value. In yetanother example, geometric correction may be applied to a projection ofa captured image onto the mat according to the known location of themat. In this manner, examples described herein may increase therobustness of image processing of a captured image in a computingsystem.

The following discussion is directed to various examples of thedisclosure. Although one or more of these examples may be preferred, theexamples disclosed should not be interpreted, or otherwise used, aslimiting the scope of the disclosure, including the claims. In addition,one skilled in the art will understand that the following descriptionhas broad application, and the discussion of any example is meant onlyto be descriptive of that example, and not intended to intimate that thescope of the disclosure, including the claims, is limited to thatexample.

Referring now to FIGS. 1-4, a computer system 100 in accordance with theprinciples disclosed herein is shown. In this example, system 100generally comprises a support structure 110, a computing device 150, aprojector unit 180, and a mat 200. Computing device 150 may comprise anysuitable computing device while still complying with the principlesdisclosed herein. For example, in some implementations, device 150 maycomprise an electronic display, a smartphone, a tablet, an all-in-onecomputer (i.e., a display that also houses the computer's board), orsome combination thereof. In this example, device 150 is an all-in-onecomputer that includes a central axis or center line 155, first or topside 150 a, a second or bottom side 150 b axially opposite the top side150 a, a front side 150 c extending axially between the sides 150 a, 150b, a rear side also extending axially between the sides 150 a, 150 b andgenerally radially opposite the front side 150 c. A display 152 definesa viewing surface and is disposed along the front side 150 c to projectimages for viewing and interaction by a user (not shown). In someexamples, display 152 includes touch sensitive technology such as, forexample, resistive, capacitive, acoustic wave, infrared (IR), straingauge, optical, acoustic pulse recognition, or some combination thereof.Therefore, throughout the following description, display 152 mayperiodically be referred to as a touch sensitive surface or display. Inaddition, in some examples, device 150 further includes a camera 154that is to take images of a user while he or she is positioned in frontof display 152. In some implementations, camera 154 is a web camera.Further, in some examples, device 150 also includes a microphone orsimilar device that is arranged to receive sound inputs (e.g., voice)from a user during operation.

Referring still to FIGS. 1-4, support structure 110 includes a base 120,an upright member 140, and a top 160. Base 120 includes a first or frontend 120 a, and a second or rear end 120 b. During operation, base 120engages with a support surface 15 to support the weight of at least aportion of the components (e.g., member 140, unit 180, device 150, top160, etc.) of system 100 during operation. In this example, front end120 a of base 120 includes a raised portion 122 that is slightlyseparated above the support surface 15 thereby creating a space orclearance between portion 122 and surface 15. As will be explained inmore detail below, during operation of system 100, one side of mat 200is received within the space formed between portion 122 and surface 15to ensure proper alignment of mat 200. However, it should be appreciatedthat in other examples, other suitable alignments methods or devices maybe used while still complying with the principles disclosed herein.

Upright member 140 includes a first or upper end 140 a, a second orlower end 140 b opposite the upper end 140 a, a first or front side 140c extending between the ends 140 a, 140 b, and a second or rear side 140d opposite the front side 140 c and also extending between the ends 140a, 140 b. The lower end 140 b of member 140 is coupled to the rear end120 b of base 120, such that member 140 extends substantially upwardfrom the support surface 15.

Top 160 includes a first or proximate end 160 a, a second or distal end160 b opposite the proximate end 160 a, a top surface 160 c extendingbetween the ends 160 a, 160 b, and a bottom surface 160 d opposite thetop surface 160 c and also extending between the ends 160 a, 160 b.Proximate end 160 a of top 160 is coupled to upper end 140 a of uprightmember 140 such that distal end 160 b extends outward therefrom. As aresult, in the example shown in FIG. 2, top 160 is supported only at end160 a and thus is referred to herein as a “cantilevered” top. In someexamples, base 120, member 140, and top 160 are all monolithicallyformed; however, it should be appreciated that in other example, base120, member 140, and/or top 160 may not be monolithically formed whilestill complying with the principles disclosed herein.

Referring still to FIGS. 1-4, mat 200 includes a central axis orcenterline 205, a first or front side 200 a, and a second or rear side200 b axially opposite the front side 200 a. In this example, a touchsensitive surface 202 is disposed on mat 200 (a “touch sensitive mat”)and is substantially aligned with the axis 205. Surface 202 may compriseany suitable touch sensitive technology for detecting and tracking oneor multiple touch inputs by a user in order to allow the user tointeract with software being executed by device 150 or some othercomputing device (not shown). For example, in some implementations,surface 202 may utilize known touch sensitive technologies such as, forexample, resistive, capacitive, acoustic wave, infrared, strain gauge,optical, acoustic pulse recognition, or some combination thereof whilestill complying with the principles disclosed herein. In addition, inthis example, surface 202 extends over a portion of mat 200 such that amat border 290 is formed to surround surface 202; however, it should beappreciated that in other examples, surface 202 may extend oversubstantially all of mat 200 while still complying with the principlesdisclosed herein.

During operation, mat 200 is aligned with base 120 of structure 110, aspreviously described to ensure proper alignment thereof. In particular,in this example, rear side 200 b of mat 200 is placed between the raisedportion 122 of base 120 and support surface 15 such that rear end 200 bis aligned with front side 120 a of base, thereby ensuring properoverall alignment of mat 200, and particularly surface 202, with othercomponents within system 100. In some examples, mat 200 is aligned withdevice 150 such that the center line 155 of device 150 is substantiallyaligned with center line 205 of mat 200; however, other alignments arepossible. In addition, as will be described in more detail below, in atleast some examples surface 202 of mat 200 and device 150 areelectrically coupled to one another such that user inputs received bysurface 202 are communicated to device 150. Any suitable wireless orwired electrical coupling or connection may be used between surface 202and device 150 such as, for example, WI-FI, BLUETOOTH®, ultrasonic,electrical cables, electrical leads, electrical spring-loaded pogo pinswith magnetic holding force, or some combination thereof, while stillcomplying with the principles disclosed herein. In this example, exposedelectrical contacts disposed on rear side 200 b of mat 200 engage withcorresponding electrical pogo-pin leads within portion 122 of base 120to transfer signals between device 150 and surface 202 during operation.In addition, in this example, the electrical contacts are held togetherby adjacent magnets located in the clearance between portion 122 of base120 and surface 15, previously described, to magnetically attract andhold (e.g., mechanically) a corresponding ferrous and/or magneticmaterial disposed along rear side 200 b of mat 200.

Referring specifically now to FIG. 3, projector unit 180 comprises anouter housing 182, and a projector assembly 184 disposed within housing182. Housing 182 includes a first or upper end 182 a, a second or lowerend 182 b opposite the upper end 182 a, and an inner cavity 183. In thisexample, housing 182 further includes a coupling or mounting member 186to engage with and support device 150 during operations. In generalmember 186 may be any suitable member or device for suspending andsupporting a computer device (e.g., device 150) while still complyingwith the principles disclosed herein. For example, in someimplementations, member 186 comprises hinge that includes an axis ofrotation such that a user (not shown) may rotate device 150 about theaxis of rotation to attain an optimal viewing angle therewith. Further,in some examples, device 150 is permanently or semi-permanently attachedto housing 182 of unit 180. For example, in some implementations, thehousing 180 and device 150 are integrally and/or monolithically formedas a single unit.

Thus, referring briefly to FIG. 4, when device 150 is suspended fromstructure 110 through the mounting member 186 on housing 182, projectorunit 180 (i.e., both housing 182 and assembly 184) is substantiallyhidden behind device 150 when system 100 is viewed from a viewingsurface or viewing angle that is substantially facing display 152disposed on front side 150 c of device 150. In addition, as is alsoshown in FIG. 4, when device 150 is suspended from structure 110 in themanner described, projector unit 180 (i.e., both housing 182 andassembly 184) and any image projected thereby is substantially alignedor centered with respect to the center line 155 of device 150.

Projector assembly 184 is generally disposed within cavity 183 ofhousing 182, and includes a first or upper end 184 a, a second or lowerend 184 b opposite the upper end 184 a. Upper end 184 a is proximateupper end 182 a of housing 182 while lower end 184 b is proximate lowerend 182 b of housing 182. Projector assembly 184 may comprise anysuitable digital light projector assembly for receiving data from acomputing device (e.g., device 150) and projecting an image or images(e.g., out of upper end 184 a) that correspond with that input data. Forexample, in some implementations, projector assembly 184 comprises adigital light processing (DLP) projector or a liquid crystal on silicon(LCoS) projector which are advantageously compact and power efficientprojection engines capable of multiple display resolutions and sizes,such as, for example, standard XGA (1024×768) resolution 4:3 aspectratio or standard WXGA (1280×800) resolution 16:10 aspect ratio.Projector assembly 184 is further electrically coupled to device 150 inorder to receive data therefrom for producing light and images from end184 a during operation. Projector assembly 184 may be electricallycoupled to device 150 through any suitable type of electrical couplingwhile still complying with the principles disclosed herein. For example,in some implementations, assembly 184 is electrically coupled to device150 through an electric conductor, WI-FI, BLUETOOTH®, an opticalconnection, an ultrasonic connection, or some combination thereof. Inthis example, device 150 is electrically coupled to assembly 184 throughelectrical leads or conductors (previously described) that are disposedwithin mounting member 186 such that when device 150 is suspended fromstructure 110 through member 186, the electrical leads disposed withinmember 186 contact corresponding leads or conductors disposed on device150.

Referring still to FIG. 3, top 160 further includes a fold mirror 162and a sensor bundle 164. Mirror 162 includes a highly reflective surface162 a that is disposed along bottom surface 160 d of top 160 and ispositioned to reflect images and/or light projected from upper end 184 aof projector assembly 184 toward mat 200 during operation. Mirror 162may comprise any suitable type of mirror or reflective surface whilestill complying with the principles disclosed herein. In this example,fold mirror 162 comprises a standard front surface vacuum metalizedaluminum coated glass mirror that acts to fold light emitted fromassembly 184 down to mat 200. In other examples, mirror 162 could have acomplex aspherical curvature to act as a reflective lens element toprovide additional focusing power or optical correction.

Sensor bundle 164 includes a plurality of sensors and/or cameras tomeasure and/or detect various parameters occurring on or near mat 200during operation. For example, in the specific implementation depictedin FIG. 3, bundle 164 includes an ambient light sensor 164 a, a camera(e.g., a color camera) 164 b, a depth sensor or camera 164 c, and athree dimensional (3D) user interface sensor 164 d. Ambient light sensor164 a is arranged to measure the intensity of light of the environmentsurrounding system 100, in order to, in some implementations, adjust thecamera's and/or sensor's (e.g., sensors 164 a, 164 b, 164 c, 164 d)exposure settings, and/or adjust the intensity of the light emitted fromother sources throughout system such as, for example, projector assembly184, display 152, etc. Camera 164 b may, in some instances, comprise acolor camera which is arranged to take either a still image or a videoof an object and/or document disposed on mat 200. Depth sensor 164 cgenerally indicates when a 3D object is on the work surface. Inparticular, depth sensor 164 c may sense or detect the presence, shape,contours, motion, and/or the 3D depth of an object (or specificfeature(s) of an object) placed on mat 200 during operation. Thus, insome implementations, sensor 164 c may employ any suitable sensor orcamera arrangement to sense and detect a 3D object and/or the depthvalues of each pixel (whether infrared, color, or other) disposed in thesensor's field-of-view (FOV). For example, in some implementationssensor 164 c may comprise a single infrared (IR) camera sensor with auniform flood of IR light, a dual IR camera sensor with a uniform floodof IR light, structured light depth sensor technology, time-of-flight(TOF) depth sensor technology, or some combination thereof. Userinterface sensor 164 d includes any suitable device or devices (e.g.,sensor or camera) for tracking a user input device such as, for example,a hand, stylus, pointing device, etc. In some implementations, sensor164 d includes a pair of cameras which are arranged to stereoscopicallytrack the location of a user input device (e.g., a stylus) as it ismoved by a user about the mat 200, and particularly about surface 202 ofmat 200. In other examples, sensor 164 d may also or alternativelyinclude an infrared camera(s) or sensor(s) that is arranged to detectinfrared light that is either emitted or reflected by a user inputdevice. It should further be appreciated that bundle 164 may compriseother sensors and/or cameras either in lieu of or in addition to sensors164 a, 164 b, 164 c, 164 d, previously described. In addition, as willexplained in more detail below, each of the sensors 164 a, 164 b, 164 c,164 d within bundle 164 is electrically and communicatively coupled todevice 150 such that data generated within bundle 164 may be transmittedto device 150 and commands issued by device 150 may be communicated tothe sensors 164 a, 164 b, 164 c, 164 d during operations. As isexplained above for other components of system 100, any suitableelectrical and/or communicative coupling may be used to couple sensorbundle 164 to device 150 such as for example, an electric conductor,WI-FI, BLUETOOTH®, an optical connection, an ultrasonic connection, orsome combination thereof. In this example, electrical conductors arerouted from bundle 164, through top 160, upright member 140, andprojector unit 180 and into device 150 through the leads that aredisposed within mounting member 186, previously described.

Referring now to FIGS. 5 and 6, during operation of system 100, light187 is emitted from projector assembly 184, and reflected off of mirror162 towards mat 200 thereby displaying an image on a projector displayspace 188. In this example, space 188 is substantially rectangular andis defined by a length L₁₈₈ and a width W₁₈₈. In some examples lengthL₁₈₈ may equal approximately 16 inches, while width W₁₈₈ may equalapproximately 12 inches; however, it should be appreciated that othervalues for both length Le and width W₁₈₈ may be used while stillcomplying with the principles disclosed herein. In addition, the sensors(e.g., sensors 164 a, 164 b, 164 c, 164 d) within bundle 164 include asensed space 168 that, in at least some examples, overlaps and/orcorresponds with projector display space 188, previously described.Space 168 defines the area that the sensors within bundle 164 arearranged to monitor and/or detect the conditions thereof in the mannerpreviously described. In some examples, both space 188 and space 168coincide or correspond with surface 202 of mat 200, previouslydescribed, to effectively integrate the functionality of the touchsensitive surface 202, projector assembly 184, and sensor bundle 164within a defined area.

Referring now to FIGS. 5-7, in some examples, device 150 directsassembly 184 to project an image onto surface 202 of mat 200. Inaddition, device 150 may also display an image on the display 152 (whichmay or may not be the same as the image projected onto surface 202 byassembly 184). The image projected by assembly 184 may compriseinformation and/or images produced by software executing within device150. A user (not shown) may then interact with the image displayed onsurface 202 and display 152 by physically engaging the touch sensitivesurface 202 of mat 200. Such interaction may take place through anysuitable method such as, direct interaction with a user's hand 35,through a stylus 25, or other suitable user input device(s).

As best shown in FIG. 7, when a user interacts with surface 202 of mat200, a signal is generated which is routed to device 150 through any ofthe electrical coupling methods and devices previously described. Oncedevice 150 receives the signal generated within mat 200, it is routed,through internal conductor paths 153, to a processor 250 whichcommunicates with a non-transitory computer-readable storage medium 260to generate an output signal which is then routed back to projectorassembly 184 and/or display 152 to implement a change in the imageprojected onto surface 202 and/or the image displayed on display 152,respectively. It should also be appreciated that during this process, auser may also be interacting with the image displayed on display 152through engagement with the touch sensitive surface disposed thereonand/or through another user input device such as, for example, akeyboard and mouse.

In addition, in some examples, stylus 25 further includes a transmitter27 that is arranged to track the position of stylus 25 (whether or notstylus 25 is interacting with surface 202) and to communicate with areceiver 270 disposed within device 150 through a wireless signal 50. Inthese examples, input received by receiver 270 from transmitter 27 onstylus 25 is also routed through paths 153 to processor 250 such that anoutput signal may be generated and routed to the assembly 184 and/or thedisplay 152 as previously described.

Further, in some examples, sensors disposed within bundle 164 (e.g.,sensors 164 a, 164 b, 164 c, 164 d) may also generate system input whichis routed to device 150 for further processing by processor 250 anddevice 260. For example, in some implementations, sensors within bundle164 may sense the location and/or presence of a user's hand 35 or stylus25 and then generate an input signal which is routed to processor 250.Processor 250 then generates a corresponding output signal which isrouted to display 152 and/or projector assembly 184 in the mannerdescribed above. In particular, in some implementations, bundle 164includes a pair of cameras or sensors that are arranged to performstereoscopic stylus tracking (e.g., of stylus 25). In still otherimplementations, stylus 25 includes a tip 26 that is coated in aninfrared retro-reflective coating (e.g., paint), thus allowing it toserve as an infrared retro-reflector. Bundle 164 (and more particularlysensors 164 c or 164 d) may then further include infrared cameras orsensors as previously described which detect infrared light that isreflected off of tip 26 of stylus 25 and thus track the location of tip26 as is moves across surface 202 during operation.

As a result, in some examples, the image projected onto surface 202 byassembly 184 serves as a second or alternative touch sensitive displaywithin system 100. In addition, interaction with the image displayed onsurface 202 is further enhanced through use of the sensors (e.g.,sensors 164 a, 164 b, 164 c, 164 d) disposed within bundle 164 asdescribed above.

Referring still to FIGS. 5-7, in addition, during operation of at leastsome examples, system 100 may capture a two dimensional (2D) image orcreate a 3D scan of a physical object such that an image of the objectmay then be projected onto the surface 202 for further use andmanipulation thereof. In particular, in some examples, an object 40 maybe placed on surface 202 such that sensors (e.g., camera 164 b, depthsensor 164 c, etc.) within bundle 164 may detect, for instance, thelocation, dimensions, and in some instances, the color of object 40, toenhance a 2D image or create a 3D scan thereof. The information gatheredby the sensors (e.g., sensors 164 b, 164 c) within bundle 164 may thenbe routed to processor 250 which communicates with device 260 aspreviously described. Thereafter, processor 350 directs projectorassembly 184 to project an image of the object 40 onto the surface 202.It should also be appreciated that in some examples, other objects suchas documents or photos may also be scanned by sensors within bundle 164in order to generate an image thereof which is projected onto surface202 with assembly 184. In addition, in some examples, once an object(s)is scanned by sensors within bundle 164, the background of the image maybe optionally, digitally removed within the resulting image projectedonto surface 202 (or shown on display 152 of device 150). Thus, in someexamples, images of physical objects (e.g., object 40) may be captured,digitized, and displayed on surface 202 during operation to quickly andeasily create a digital version of a physical object to allow forfurther manipulation thereof consistent with the manner describedherein.

Referring now to FIG. 8, a perspective view of mat 200 in accordancewith the principles disclosed herein is shown. In the example of FIG. 8,touch sensitive surface 202 may be disposed on a portion of mat 200 andmat border 290 may surround surface 202. In FIG. 8, surface 202 and matborder 290 may be substantially aligned with central axis 205. In someexamples, a mat characteristic of mat 200 may be provided to computingdevice 150 for image processing. For example, the color, reflectance,and location of mat 200 may be provided to computing device 150 forimage processing. For example, the computing device 150 may process animage captured by camera 164 b to adjust color balance, reduce lensdistortion, adjust image illumination, geometric correction, etc. Insome examples, a captured image may be segmented and each segment of theimage may be separately processed. For example, a captured image may besegmented into pixels and processed to set a first pixel to black (i.e.,a black point) or white (i.e., a white point) and other pixels may beprocessed to adjust color balance accordingly. Referring to FIGS. 1-8,the computing device 150 may display the processed image captured bycamera 164 b on display 152. In other examples, the processed image maybe projected by projector assembly 184 via top 160 onto surface 202, asdescribed herein.

In an example, the color of mat 200 may be set in computing device 150according to at least one or more of a RGB value, a hex value, and along value. In some examples, mat 200 may be uniformly colored and maybe of a neutral color. In other examples, the color of mat 200 may benon-uniform and of any color. In yet another example, the color of matborder 290 may be the same as or differ from the color of surface 202.Computing device 150 may use the set color of mat 200 and a reflectanceof mat 200 to adjust the color balance of a captured image of mat 200and any other objects captured in the image by camera 164 b. In anexample, the reflectance of mat 200 may be set in the computing device150 or determined by the computing device 150 by analyzing a capturedimage of mat 200 and sensor values from sensor bundle 164.

In an example, the size and location of mat 200 may also be provided tocomputing device 150 for image processing. In some examples, computingdevice 150 may determine a location of mat border 290 in the field ofcamera 164 b according to a distance and angle between the camera 164 band mat 200. In an example, computing device 150 may process an imagecaptured by camera 164 b to adjust features of the image based on thecolor of the mat 200 and the location of the mat 200. For example,computing device 150 may process an image captured by camera 164 b toreduce lens distortion according to a location of mat border 290. Insuch an example, computing device 150 may process the captured image toalign the location of mat border 290 in the captured image with theknown location of mat border 290. In another example, computing device150 may adjust the captured image to reduce lens distortion (e.g.,barrel distortion, pincushion distortion, mustache distortion, etc.) ofthe mat border 290 and adjust other segments of the captured imageaccordingly. In yet another example, the size and location of mat 200may be used for geometric correction of an image projected onto surface202 by projector assembly 184 via top 160.

In some examples, computing device 150 may process a captured imagefurther according to a sensor value from sensor bundle 164, data fromtouch sensitive surface 202, or any other sensors in the system 100. Forexample, a sensor value for ambient light may be used along with thelocation of the mat 200 and the color of mat 200 to correct imageillumination non-uniformity in the captured image. In other examples, asensor value from an infrared camera sensor, a depth sensor, a threedimensional user interface sensor, and a time of flight depth sensor insensor bundle 164 may provide additional information to computing device150 for image processing. In an example, computing device 150 mayprocess a captured image for geometric correction according to adetected location and other characteristics of an object disposed on mat200. In such an example, the computing device 150 may determine that aportion of mat 200 is covered by the object according to data from touchsensitive surface 202 and may determine other portions of mat 200 are ina shadow formed by the object according to sensor values from sensorbundle 164. In this example, computing device 150 may process thecaptured image according to the determined location of the object forgeometric correction of the projection of the captured image ontosurface 202 by projector assembly 184.

Referring now to FIG. 9, a block diagram of an example computing device150 to process an image captured in the system of FIG. 1 in accordancewith the principles disclosed herein is shown. In the example of FIG. 9,computing device 150 includes a processing resource 910 and amachine-readable storage medium 920 comprising (e.g., encoded with)instructions 922, 924, and 926 executable by processing resource 910. Insome examples, storage medium 920 may include additional instructions.In some examples, instructions 922, 924, and 926, and any otherinstructions described herein in relation to storage medium 920, may bestored on a machine-readable storage medium remote from but accessibleto computing device 150 and processing resource 910 (e.g., via acomputer network). In some examples, instructions 922, 924, and 926 maybe instructions of a computer program, computer application (app),agent, or the like, of computing device 900. In other examples, thefunctionalities described herein in relation to instructions 922, 924,and 926 may be implemented as engines comprising any combination ofhardware and programming to implement the functionalities of theengines, as described below.

In examples described herein, a processing resource may include, forexample, one processor or multiple processors included in a singlecomputing device (as shown in FIG. 9) or distributed across multiplecomputing devices. A “processor” may be at least one of a centralprocessing unit (CPU), a semiconductor-based microprocessor, a graphicsprocessing unit (GPU), a field-programmable gate array (FPGA) toretrieve and execute instructions, other electronic circuitry suitablefor the retrieval and execution of instructions stored on amachine-readable storage medium, or a combination thereof. Processingresource 910 may fetch, decode, and execute instructions stored onstorage medium 920 to perform the functionalities described below. Inother examples, the functionalities of any of the instructions ofstorage medium 920 may be implemented in the form of electroniccircuitry, in the form of executable instructions encoded on amachine-readable storage medium, or a combination thereof.

As used herein, a “machine-readable storage medium” may be anyelectronic, magnetic, optical, or other physical storage apparatus tocontain or store information such as executable instructions, data, andthe like. For example, any machine-readable storage medium describedherein may be any of Random Access Memory (RAM), volatile memory,non-volatile memory, flash memory, a storage drive (e.g., a hard drive),a solid state drive, any type of storage disc (e.g., a compact disc, aDVD, etc.), and the like, or a combination thereof. Further, anymachine-readable storage medium described herein may be non-transitory.

In the example of FIG. 9, instructions 922 may actively acquire (e.g.,retrieve, etc.) or passively acquire (e.g., receive, etc.) in computingdevice 150 an image 905 (“captured image 905”) of mat 200 captured bycamera 164 b.

In instructions 924, the computing device 150 may process the capturedimage 905 according to a mat characteristic of mat 200. The matcharacteristic of mat 200 may be any of the characteristics describedabove with respect to FIG. 8.

In instructions 926, computing device 150 may display the processedimage on display 152 of system 100. In other examples, the computingdevice 150 may project the processed image onto surface 202 of mat 200.

In some examples, instructions 922, 924, and 926 may be part of aninstallation package that, when installed, may be executed by processingresource 910 to implement the functionalities described herein inrelation to instructions 922, 924, and 926. In such examples, storagemedium 920 may be a portable medium, such as a CD, DVD, flash drive, ora memory maintained by a computing device from which the installationpackage can be downloaded and installed. In other examples, instructions922, 924, and 926 may be part of an application, applications, orcomponent already installed on computing device 150 including processingresource 910. In such examples, the storage medium 920 may includememory such as a hard drive, solid state drive, or the like. In someexamples, functionalities described herein in relation to FIG. 9 may beprovided in combination with functionalities described herein inrelation to any of FIGS. 1-8.

FIG. 10 is a flowchart of an example method 1000 for image processing.Although execution of method 1000 is described below with reference tocomputing device 150 and system 100 described above, other suitablesystems for the execution of method 1000 can be utilized. Additionally,implementation of method 1000 is not limited to such examples.

At 1002 of method 1000, camera 164 b of system 100 may capture an imageof mat 200 from its fixed position in the system 100. In the example ofFIG. 10, the color of mat 200 and the reflectance of mat 200 may be setin computing device 150, for example, according to a hex value, etc.

At 1004, computing device 150 may process the captured image accordingto the color of mat 200, the reflectance of mat 200 and a sensor valuefrom ambient light sensor 164 a.

At 1006, computing device 150 may display the processed image on display152. In an example, the processed image may be projected onto surface202 by projector assembly 184 via top 160.

Although the flowchart of FIG. 10 shows a specific order of performanceof certain functionalities, method 1000 is not limited to that order.For example, the functionalities shown in succession in the flowchartmay be performed in a different order, may be executed concurrently orwith partial concurrence, or a combination thereof. In some examples,functionalities described herein in relation to FIG. 10 may be providedin combination with functionalities described herein in relation to anyof FIGS. 1-9.

While device 150 has been described as an all-in-one computer, it shouldbe appreciated that in other examples, device 150 may further employ theuse of more traditional user input devices such as, for example, akeyboard and a mouse. In addition, while sensors 164 a, 164 b, 164 c,164 d within bundle 164 have been described as each representing asingle sensor or camera, it should be appreciated that each of thesensors 164 a, 164 b, 164 c, and 164 d may each include multiple sensorsor cameras while still complying with the principles described herein.Further, while top 160 has been described herein as a cantilevered top,it should be appreciated that in other examples, top 160 may besupported at more than one point and is thus may not be cantileveredwhile still complying with the principles disclosed herein.

What is claimed is:
 1. A system comprising: a camera included on asupport structure; a computing device attached to the support structureand communicatively coupled to the camera; and a mat communicativelycoupled to the computing device; wherein: the computing device is tocause the camera to scan the mat to produce a scanned image; and thecomputing device is to process the scanned image according to the matcharacteristic to adjust the scanned image.
 2. The system of claim 1,wherein processing the scanned image to adjust the scanned imageincludes adjusting a color balance of the scanned image according to aset color of the mat and a reflectance of the mat.
 3. The system ofclaim 1, wherein processing the scanned image to adjust the scannedimage includes adjusting an image illumination of the scanned imageaccording to a location of the mat and an ambient light value from anambient light sensor included on the support structure.
 4. The system ofclaim 1, wherein processing the scanned image to adjust the scannedimage includes adjusting a lens distortion according to a location of aborder of the mat.
 5. The system of claim 1, wherein the mat is atouch-sensitive mat to determine a location of an object on the mat. 6.The system of claim 5, wherein processing the scanned image to adjustthe scanned image includes adjusting a geometric correction of thescanned image according to the determined location of the object on themat and characteristics of the object.
 7. The system of claim 5, whereinthe computing device is to further process the scanned image accordingto the determined location of the object on the mat.
 8. The system ofclaim 1, further comprising a sensor, wherein the sensor is at least oneof an ambient light sensor, an infrared camera sensor, a depth sensor, athree dimensional user interface sensor, and a time of flight depthsensor.
 9. The system of claim 8, wherein the computing device is toprocess the scanned image according to a sensor value of the sensor. 10.A non-transitory machine-readable storage medium comprising instructionsexecutable by a processing resource to: receive a scanned image of a matfrom a camera; process the scanned image according to a characteristicof the mat to adjust the scanned image; and display the processed imageon a display of a computing device.
 11. The medium of claim 10,comprising instructions to receive a sensor value from a sensor.
 12. Themedium of claim 11, comprising instructions to process the scanned imageto adjust the scanned image according to the characteristic of the matand the sensor value.
 13. The medium of claim 10, comprisinginstructions to determine, via a sensor, a location of an object on themat.
 14. The medium of claim 13, comprising instructions to process thescanned image to adjust the scanned image according to thecharacteristic of the mat and the location of the object.
 15. A method,comprising: capturing, by a camera, an image of a mat; adjusting, by acomputing device, the captured image according to characteristics of themat and a sensor value of a sensor; and displaying, by display of thecomputing device, the adjusted image.
 16. The method of claim 15,wherein the method includes: segmenting the adjusted image into aplurality of segments; and adjusting color values of each of theplurality of segments.
 17. The method of claim 16, wherein the methodincludes: adjusting the captured image by reducing lens distortion of aborder of the mat included in the captured image; and adjusting thecolor values of each of the plurality of segments using the reduced lensdistortion of the border of the mat.
 18. The method of claim 17, whereinthe method includes reducing the lens distortion according to a distancebetween the mat and the camera.
 19. The method of claim 15, wherein themethod includes determining a location of an object on the mat.
 20. Themethod of claim 19, wherein the method includes adjusting the capturedimage according to the location of the object on the mat.